X-ray test is a real-time non-destructive analysis to check the internal hardware components of the component. It mainly checks the lead frame of the chip, wafer size, gold wire bonding diagram, ESD damage and holes. Customers can provide good products for comparison. examine.

Application scope: detection of internal cracks and foreign body defects in metal materials and parts, plastic materials and parts, electronic components, electronic components, LED components, etc., analysis of internal displacements such as BGA, circuit boards, etc.; distinguishing empty welding and virtual welding Wait for BGA welding defect analysis, etc.